Method of fabricating silicon single crystals

Abstract

When the pulling speed is V(mm/min), the temperature gradient along the crystal axis within the temperature range from the melting point of silicon to 1300.degree. C. is G1 (.degree. C./mm), the temperature gradient along the crystal axis within the temperature range from 1150.degree. to 1080.degree. C. is G2 (.degree. C./mm), and the octahedral-shaped void density is d (pieces/cm.sup.3), crystals are grown under a condition satisfying: V/G1>0.581.times.V.times.G2-(d-4.3.times.10.sup.3)/2.65.times.10.sup.6 and V/G1>0.25. In this way, the defect density is reduced to less than 1.times.106 pieces/cm.sup.3 and silicon single crystals having superior gate oxide integrity and semiconductor device yield are obtained.

Dependencies are inferred from the claim text.