Clip on heat exchanger for a memory module and assembly method

An apparatus for dissipating heat generated by electronic components on a surface of a memory module, the apparatus comprising:

• a first heat exchanger member having at least one thermally conductive fin, said fin being configured to engage a surface of a corresponding electronic component on a first surface of the memory module;
• a second heat exchanger member having an inner surface configured to engage a second surface of the memory module;
• and
• means for releasably securing the first and second heat exchanger members together about the memory module.

A method of assembling a heat exchanger about a memory module having electronic components positioned on at least one surface thereof, said method comprising:

• positioning a first heat exchanger member adjacent a first side of the memory module such that an inner surface of one or more thermally conductive fins of the first heat exchanger member engages with a corresponding one or more electronic components on the first side of the memory module;
• positioning a second heat exchanger member adjacent a second side of the memory module such that an inner surface of the second heat exchanger member engages the second surface of the memory module;
• and
• snapping a clip protruding from the first heat exchanger member into engagement with the second heat exchanger member.