US 5,965,842 A · Low impedance connection for an EMI containment shield including metal plating bonded to the shielded equipment through openings in a conductive ribbon

Abstract

The present invention provides an EMI shield having a low impedance connection to ground for use in electronic equipment, particularly computer systems. More particularly, an EMI shield for electronic equipment is disclosed which includes a conductive ribbon, such as a copper ribbon with a polyimide backing, the conductive ribbon having openings and coupled to a ground plane. The conductive ribbon contacts a surface of a section of the electronic equipment to be shielded. A hold down frame of a non-conductive material holds the conductive ribbon in a fixed position on the section of the electronic equipment to be shielded. A metal plating, such as a combination of copper and nickel, bonds to the section of the electronic equipment to be shielded and to the conductive ribbon. The metal plating contains the EMI. The plating also bonds to the section of the electronic equipment through the openings of the conductive ribbon wherein the metal plating and the conductive ribbon form a low impedance connection to ground. In one embodiment the openings in the conductive ribbon are slots and in another the openings are circular holes.

Claims18

Dependent claims

An electro-magnetic interference (EMI) shield for shielding EMI in an electronic equipment comprising:

a ground plane;
a conductive ribbon having bond openings, the conductive ribbon being coupled to the ground plane and contacting a surface of a section of the electronic equipment to be shielded;
a hold down frame of a non-conductive material holding the conductive ribbon in a fixed position on the section of the electronic equipment to be shielded;
and
a metal plating deposited upon and bonded to the conductive ribbon and deposited extending through the bond openings of the conductive ribbon to bond directly, without intervening connectors, to a section of a structural enclosure of the electronic equipment to be shielded, the metal plating containing EMI and forming a low impedance connection with the ground plane and the conductive ribbon.

2 more elements

Dependencies are inferred from the claim text.

Low impedance connection for an EMI containment shield including metal plating bonded to the shielded equipment through openings in a conductive ribbon

Life of this patent

Low impedance connection for an EMI containment shield including metal plating bonded to the shielded equipment through openings in a conductive ribbon

Life of this patent

Abstract

Claims18