Method of forming contact hole and multilayered lines structure

Abstract

A method of providing a contact hole including (a) depositing a first conductive film on a substrate and patterning the first conductive film to form a first electrode line, (b) depositing an insulating film on the first electrode line and the substrate, (c) forming a contact hole in the insulating film over a top surface of the first electrode line, and (d) depositing a second conductive film on the insulating film and the contact hole and patterning the second conductive film to form a second electrode line, wherein a surface of the first conductive film is subjected to an oxidizing operation in step (a) so that a contact resistance of the contact hole is lowered.

Dependencies are inferred from the claim text.