Method of assembling a heat sink assembly
AssigneeLSI Logic Corporation
InventorsMark R. Schneider, Joseph Joroski
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AssigneeLSI Logic Corporation
InventorsMark R. Schneider, Joseph Joroski
Estimating the term…
Method of cooling electronic systems an semiconductor devices as well as an electronic system and a semiconductor device with heat dissipating elements. The method includes the steps of providing an electronic system or a semiconductor device with a heat sink including at least a first element having a generally flat shape with a shoulder projecting from one generally flat surface, and configured to thermally engage similar elements. In one embodiment, a first and a second heat sink element are provided, with one of the first and second elements having a protrusion and the other of the first and second elements defining a depression configured to receive and retain said protrusion. Alternatively, the first and second elements may be bonded together with a thermally conductive adhesive.
A method of assembling a heat sink assembly, comprising the steps of:
A method of assembling a heat sink assembly, comprising the steps of:
A method of assembling a heat sink assembly, comprising the steps of:
A method of assembling a heat sink assembly, comprising the steps of:
A method of assembling a heat sink assembly, comprising the steps of:
A method of assembling a heat sink assembly, comprising the steps of:
A method of assembling a heat sink assembly, comprising the steps of:
A method of assembling a heat sink assembly, comprising the steps of:
A method of assembling a heat sink assembly, comprising the steps of:
Dependencies are inferred from the claim text.