US 5,963,426 A · Electronic micropackaging assembly and its fabrication

Abstract

A multilayer microelectronic module assembly has at least two planar module structures, in the form of boards lying parallel to each other and which must be electrically interconnected. Each planar module structure has electronic circuitry thereon and electrical interconnect locations in registry with corresponding electrical interconnect locations on the adjacent planar module structure. The electrical interconnections are accomplished by closely spaced direct electrical interconnectors extending between the respective electrical interconnection locations on the adjacent planar module structures. Each module assembly is preferably affixed to a support. Multiple supports are arranged parallel to each other and electrically interconnected by similar direct electrical interconnectors. By accomplishing the electrical interconnections using direct electrical interconnectors rather than a conventional backplane, there is room at the periphery of the planar module structures for attachment to a thermally conductive heat sink, which efficiently removes heat generated by the electronic circuitry on the planar module structures.

Claims22

Dependent claims

A microelectronic assembly, comprising

a first module assembly, including
a first planar module structure having a first-module edge and comprising
first electronic circuitry, and
a plurality of first-module electrical interconnect locations on the first electronic circuitry,
a second planar module structure parallel to but spaced apart from the first planar module structure by a distance of at least about 0.050 inches and having a second-module edge, the second planar module structure comprising
second electronic circuitry, and
a plurality of second-module electrical interconnect locations on the second electronic circuitry, the second-module electrical interconnect locations being in registration with the first-module electrical interconnect locations,
a plurality of module direct electrical interconnectors respectively extending between the plurality of first-module electrical interconnect locations and the plurality of second-module electrical interconnect locations;
and
a thermally conductive heat sink with which the first-module edge of the first planar module structure and the second-module edge of the second planar module structure are in direct thermal contact, wherein the plurality of module direct electrical interconnectors do not contact and do not pass through the heat sink.

7 more elements

A microelectronic assembly, comprising

a first module assembly and a second module assembly, each module assembly including
a first planar module structure having a first-module edge and comprising
first electronic circuitry, and
a plurality of first-module electrical interconnect locations on the first electronic circuitry,
a second planar module structure parallel to but spaced apart from the first planar module structure and having a second-module edge, the second planar module structure comprising
second electronic circuitry, and
a plurality of second-module electrical interconnect locations on the second electronic circuitry, the second-module electrical interconnect locations being in registration with the first-module electrical interconnect locations,
a plurality of module direct electrical interconnectors respectively extending between the plurality of first-module electrical interconnect locations and the plurality of second-module electrical interconnect locations;
a first support to which the first module assembly is affixed;
a second support to which the second module assembly is affixed, such that the first module assembly and the second module assembly are separated by a support distance;
a plurality of support direct electrical interconnectors respectively extending between the first support and the second support;
and
a thermally conductive heat sink to which the first-module edge of the first planar module structure and the second-module edge of the second planar module structure of each module assembly are in direct thermal contact.

10 more elements

Dependencies are inferred from the claim text.

Electronic micropackaging assembly and its fabrication

Life of this patent

Electronic micropackaging assembly and its fabrication

Life of this patent

Abstract

Claims22