Method and apparatus for processing a semiconductor wafer on a robotic track having access to in situ wafer backside particle detection

A method for processing a semiconductor wafer using a semiconductor processing tool, the method comprising the steps of:

• removing the semiconductor wafer from a semiconductor wafer carrier that is attached to the semiconductor processing tool;
• placing the semiconductor wafer into a first process chamber of the semiconductor processing tool, the semiconductor wafer being coated with photosensitive material within the first process chamber;
• removing the semiconductor wafer from the first process chamber using a robotic system;
• and
• performing in situ contaminant detection on an exposed backside of the semiconductor wafer using the robotic system.

A method for processing a semiconductor wafer using a semiconductor processing tool, the method comprising the steps of:

• processing the semiconductor wafer in a processing chamber located within the semiconductor processing tool;
• removing the semiconductor wafer from the processing chamber using a robotic arm, the robotic arm exposing a backside portion of the semiconductor wafer when the semiconductor wafer is placed onto the robotic arm;
• and
• in situ contaminant scanning a predetermined region on the backside portion of the semiconductor wafer, the predetermined region being an area of the backside of the semiconductor wafer which is most likely to be contaminated.

A method for processing a semiconductor wafer using a semiconductor processing tool, the method comprising the steps of:

• processing the semiconductor wafer in a processing chamber;
• removing the semiconductor wafer from the processing chamber using a robotic interface, the robotic interface having:
• (1) a robotic arm which enables physical movement of the semiconductor wafer;
• (2) means for supporting the semiconductor wafer during movement;
• (3) a laser source physically connected to the robotic arm so that the laser source moves with the robotic arm;
• (4) and a detector physically connected to the robotic arm so that the detector moves along with the robotic arm;
• and (5) movement means for moving at least one of the laser source or the detector to scan a backside of the semiconductor wafer when the semiconductor wafer is being supported by the means for supporting;
• in situ contaminant scanning the backside of the semiconductor wafer using the laser source and the detector within the semiconductor processing tool;
• and
• cleaning the semiconductor wafer if the step of in situ contaminant scanning indicates that the semiconductor wafer contains backside contamination beyond a specified threshold.

A semiconductor wafer processing tool comprising:

• a plurality of process chambers;
• a semiconductor wafer carrier region;
• a robotic system for transferring semiconductor wafers between the plurality of process chambers and the semiconductor wafer carrier region, the robotic system having at least one robotic motion unit comprising:
• a robotic arm;
• means for supporting a semiconductor wafer coupled to the robotic arm;
• a laser coupled to the robotic arm so that the laser follows the robotic arm as the robotic arm moves between chambers in the plurality of process chambers, the laser being adapted to direct a laser beam at a backside of a semiconductor wafer when the semiconductor wafer is supported by the means for supporting;
• laser movement means for moving the laser in order to scan the laser along a backside of a semiconductor wafer that is supported by the means for supporting;
• and
• a detector coupled to the robotic arm so that the detector follows the robotic arm as the robotic arm moves between chambers in the plurality of process chambers, the detector being adapted to receive laser reflection from the backside of the semiconductor wafer when the semiconductor wafer is supported by the means for supporting;
• and
• computer means coupled to the semiconductor wafer processing tool for storing and processing semiconductor wafer contaminant data detected by the detector.

A method for processing a semiconductor wafer using a semiconductor processing tool, the method comprising the steps of:

• removing the semiconductor wafer from a semiconductor wafer carrier that is attached to the semiconductor processing tool;
• performing in situ contaminant detection on an exposed backside of the semiconductor wafer using a robotic system;
• placing the semiconductor wafer into a first process chamber of the semiconductor processing tool, the semiconductor wafer being coated with an adhesion-promoting material within the first process chamber;
• removing the semiconductor wafer from the first process chamber using the robotic system;
• performing in situ contaminant detection on an exposed backside of the semiconductor wafer using the robotic system;
• placing the semiconductor wafer into a second process chamber of the semiconductor processing tool, the semiconductor wafer being coated with photosensitive material within the second process chamber;
• removing the semiconductor wafer from the second process chamber using the robotic system;
• performing in situ contaminant detection on an exposed backside of the semiconductor wafer using the robotic system;
• placing the semiconductor wafer into a third process chamber of the semiconductor processing tool, the semiconductor wafer being baked within the third process chamber;
• removing the semiconductor wafer from the third process chamber using the robotic system;
• performing in situ contaminant detection on an exposed backside of the semiconductor wafer using the robotic system;
• placing the semiconductor wafer into a fourth process chamber of the semiconductor processing tool, the semiconductor wafer being lithographically exposed within the fourth process chamber;
• removing the semiconductor wafer from the fourth process chamber using the robotic system;
• and
• performing in situ contaminant detection on an exposed backside of the semiconductor wafer using the robotic system.