Photoresist composition comprising a copolymer of a hydroxystyrene and a (meth)acrylate substituted with an alicyclic ester substituent
AssigneeInternational Business Machines Corporation
InventorsRobert David Allen, Ratnam Sooriyakumaran
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Abstract
The present invention relates to an improved chemically amplified photoresist composition comprising (i) a photosensitive acid generator and (ii) a polymer comprising the reaction product of hydroxystyrene with a monomer selected from acrylate or methacrylate having an alicyclic ester substituent.
Claims12
A photosensitive resist composition comprising (i) a radiation-sensitive acid generator and (ii) a polymer comprising hydroxystyrene and a monomer selected from acrylate or methacrylate having an alicyclic ester substituent, wherein the hydroxystyrene monomer comprises about 80-95% of the polymer.
A photosensitive resist composition comprising (i) iodonium sulfonate and (ii) poly(hydroxystyrene-co-isobornyl acrylate), wherein the hydroxystyrene monomer comprises about 80-95% of the polymer.
A photosensitive resist composition comprising (i) iodonium sulfonate and (ii) poly(hydroxystyrene-co-isobornyl methacrylate), wherein the hydroxystyrene monomer comprises about 80-95% of the polymer.
A process for generating a resist image on a substrate comprising the steps of:
- (a) coating a substrate with a film comprising (i) a radiation-sensitive acid generator and (ii) a polymer comprising hydroxystyrene and monomer selected from acrylate or methacrylate having an alicyclic ester substituent;
- wherein the hydroxystyrene monomer comprises about 80-95% of the polymer;
- (b) heating the film to a temperature above 20 degrees centigrade below the glass transition temperature of the film;
- (c) imagewise exposing the film to radiation;
- and
- (d) developing the image to expose the substrate.
Dependencies are inferred from the claim text.