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US 5,958,631 AGranted
X-ray mask structure
AssigneeInternational Business Machines Corporation
InventorsRaul E. Acosta, Juan R. Maldonado
Life of this patent
Estimating the term…
Abstract
A universal mask for use in making Integrated Circuits. The individual size masks are produced on a wafer having standardized, large size membrane area. A combined X-ray blocking and membrane stiffening layer is applied on at least one side of the wafer. This stiffening/blocking layer includes an X-ray transparent region having a size commensurate with the desired exposure field and aligned therewith.
Claims13
An exposure mask for use in a lithography process for exposing a desired pattern onto a chip, the mask comprising:
- a) a substantially X-ray opaque substrate having parallel top and bottom surfaces, the substrate including an X-ray transparent membrane also having a top and a bottom surface;
- b) a layer of an X-ray absorbing material on said membrane comprising a desired pattern;
- and
- c) a first X-ray blocking/stiffening layer, over at least a portion of said X-ray opaque body top surface and membrane top surface, said first blocking/stiffening layer having a first X-ray transparent mask frame region commensurate and aligned with the desired exposure field.
1 more element
Dependencies are inferred from the claim text.