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US 5,958,100 AGranted
Process of making a glass semiconductor package
AssigneeMicron Technology, Inc.
InventorsWarren M. Farnworth, Alan G. Wood
Life of this patent
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Abstract
A process of making hermetically sealed glass semiconductor packages by injecting molding an electronic device within a body of molten thermoplastic glass which is solidified by cooling. The glass has a sealing temperature not over 350.degree. C. and a CTE not over 110.times.10.sup.-7 /.degree.C. and may be made of tin-phosphorus oxyfluoride or lead sealing glasses.
Claims2
A process of making a glass semiconductor package for an electronic device, comprising:
- placing the electronic device in a mold;
- injecting molten thermoplastic glass consisting essentially of a glass having a sealing temperature not over 350.degree. C. and a coefficient of thermal expansion not over 110.times.10.sup.-7 /.degree.C. into the mold to surround the electronic device with thermoplastic glass;
- and
- solidifying the molten thermoplastic glass by cooling after the glass is injected into the mold.
1 more element
Dependencies are inferred from the claim text.