Linearly moving mechanism
AssigneeAdvantest Corporation
InventorHiroyuki Takahashi
Life of this patent
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AssigneeAdvantest Corporation
InventorHiroyuki Takahashi
Estimating the term…
A linearly moving mechanism is provided which allows for shortening the length of linear guide rails mounted to a fixed part and a movable part, respectively. A first linear guide rail 31A is mounted to the side surface of the fixed part opposing the movable part while a second linear guide rail 31B is mounted to the side surface of the movable part opposing the fixed part so as to be in opposing relation to the first linear guide rail. First and second movable members 33A and 33B are slidably engaged with the first and second linear guide rails, respectively. A movable member support 34 supports the first and second movable members thereon toward one end of one of the first and second linear guide rails and toward the other end of the other of the rails, respectively, in the state that the first and second linear guide rails are in opposing relation to each other. Tension coil springs 19A and 19B impart a biasing force to the movable part and the movable member support, respectively, so as to hold the first and second linear guide rails in opposing relation to each other.
A linearly moving mechanism including a fixed part and a movable part having side surfaces opposing each other, said movable part being adapted to reciprocally move along a straight line relative to said fixed part, said linearly moving mechanism comprising:
A linearly moving mechanism including a fixed part and a movable part having side surfaces opposing each other, said movable part being adapted to reciprocally move along a straight line relative to said fixed part, said linearly moving mechanism comprising:
A semiconductor device transporting and handling apparatus including a test section disposed in a constant temperature chamber for testing a semiconductor device under test applied with a predetermined temperature stress and a transport means for grasping a semiconductor device under test applied with a predetermined temperature stress and transporting it to said test section in said constant temperature chamber, said semiconductor device transporting and handling apparatus being adapted to transport semiconductor devices to said test section, followed by transporting the semiconductor devices which have been tested in the test section out of the constant temperature chamber and sorting out the tested semiconductor devices on the basis of the test results, and being characterized by including a linearly moving mechanism which comprises:
A semiconductor device transporting and handling apparatus including a test section disposed in a constant temperature chamber for testing a semiconductor device under test applied with a predetermined temperature stress and a transport means for grasping a semiconductor device under test applied with a predetermined temperature stress and transporting it to said test section in said constant temperature chamber, said semiconductor device transporting and handling apparatus being adapted to transport semiconductor devices to said test section, followed by transporting the semiconductor devices which have been tested in the test section out of the constant temperature chamber and sorting out the tested semiconductor devices on the basis of the test results, and being characterized by including a linearly moving mechanism which comprises:
Dependencies are inferred from the claim text.