Low cost hermetic sealed microwave module packaging
AssigneeTRW Inc.
InventorsSteven S. Chan, John E. Dowsing, III, Jason E. Snodgress
Life of this patent
Estimating the term…
Abstract
The invention relates to a method for producing low cost hermetic Integrated Module Assembly (IMA) packaging, where an aluminum coating (24) is deposited on a poly-tetrafluoral-ethaline substrate (20), the aluminum coating (24) is selectively etched to form a waveguide window (26) and the substrate (20) is selectively treated over the waveguide window (26) to produce a non-conductive hermetic seal. The substrate (20) is then joined to a metal carrier (28) containing the waveguide (30). As a result of using selectively treated low cost substrates to produce hermetic seals, more expensive substrates are not required to form hermetic seals over substrate to waveguide interconnections.
Claims20
A method for producing hermetic packaging, said method comprising the steps of:
- providing a metallized surface on a side of a substrate;
- selectively etching an area from the metallized surface to produce an etched window;
- after etching, coating a thin layer of metallic material over the entire surface;
- after coating, selectively etching the metallic material from the metallized surface, except in the area of the etched window, to produce a waveguide window;
- after etching, selectively treating the metallic material to render the metallic material non-conductive;
- and
- joining the substrate to a metal carrier containing a waveguide by sealing the metallized surface to a metal carrier whereby the waveguide window is coincident with an area of an opening of the waveguide.
Dependencies are inferred from the claim text.