Apparatus for testing a nonpackaged die

An apparatus for making a temporary electrical connection with an integrated circuit die having interconnect pads, comprising a support member, a plate member spaced apart from the support member, an elastomeric material disposed between the support member and the plate member, a plurality of substantially rigid contact elements, the plate member having opposite first and second surfaces and provided with a plurality of bores extending through the first and second surfaces for sidably receiving the contact elements and a package assembly adapted for carrying the die and for bringing the contact elements into registration and engagement with the interconnect pads to make nonpermanent temporary electrical connections therebetween, the elastomeric material urging each contact element against an interconnect pad and permitting individual movement of each contact element to facilitate engagement of the contact elements and interconnect pads and provide a substantially uniform contact load between the contact elements and interconnect pads.