EMI-attenuating air ventilation panel
AssigneeHewlett-Packard Company
InventorsBrad E. Clements, Kristina L. Mann, Andrew M. Cherniski
Life of this patent
Estimating the term…
Abstract
EMI-attenuating air ventilation panel for electrical and electronic systems. An opening through a metallic panel is realized using an extrusion method in order to obtain a tube leaving the opening at one end. The periphery of the opening at the other side of the extruded tube has a smooth edge in order to improve air circulation. A multitude of such extruded holes are critically placed on the panel to form an array. The panel in turn is mounted in an electrical or electronic system to allow air cooling while the extruded tubes attenuate EMI radiation to and from electrical circuits.
Claims21
An EMI-attenuating air ventilation panel for an electronic device enclosure, comprising:
- an electrically conductive panel having a ventilation hole formed in it, wherein said electrically conductive panel has an upstream airflow side and a downstream airflow side;
- a waveguide electrically and mechanically coupled to said electrically conductive panel at the periphery of said air ventilation hole, the axis of said waveguide extending away from said electrically conductive panel in a direction approximately normal to said conductive panel;
- and
- a smooth surface joining said upstream airflow side of said electrically conductive panel with the inner surface of said waveguide.
An EMI-attenuating air ventilation panel for an electronic device enclosure, comprising:
- an electrically conductive panel having a plurality of air ventilation holes formed in it, wherein said electrically conductive panel has an upstream airflow side and a downstream airflow side;
- each of said plural air ventilation holes having a waveguide electrically and mechanically coupled to said electrically conductive panel at the periphery of the air ventilation hole, the axis of said waveguide extending away from said electrically conductive panel in a direction approximately normal to said conductive panel;
- and
- a plurality of smooth surfaces joining said upstream airflow side of said electrically conductive panel with the inner surface of each of said waveguides.
An electronic device enclosure having air ventilation and EMI-attenuation characteristics comprising:
- a casing;
- at least one EMI-attenuating air ventilation panel, each comprising an electrically conductive panel having at least one air ventilation hole formed in it, wherein each of said ventilation holes has a waveguide electrically and mechanically coupled to said electrically conductive panel at the periphery of said air ventilation holes, the axis of said waveguides extending away from said electrically conductive panel in a direction approximately normal to said electrically conductive panel, wherein said electrically conductive panel has an upstream airflow side and a downstream airflow side;
- a smooth surface joining said upstream airflow side of said electrically conductive panel with the inner surface of each of said waveguides;
- and
- a cooling fan for circulating air into said casing through said air ventilation holes.
Dependencies are inferred from the claim text.