Polish process and slurry for planarization
AssigneeInternational Business Machines Corporation
InventorMaria Ronay
Life of this patent
Estimating the term…
Abstract
A slurry containing abrasive particles and exhibiting normal stress effects. The slurry further contains non-polishing particles resulting in reduced polishing rate at recesses, while the abrasive particles maintain high polish rates at elevations. This leads to improved planarization.
Claims34
A polish slurry comprising abrasive particles and exhibiting normal stress effect and further comprising polyelectrolyte having ionic moieties of a charge that differs from that associated with said abrasive particles and wherein the concentration of said polyelectrolyte is about 5 to about 50 percent by weight of said abrasive particles and wherein said polyelectrolyte has a molecular weight of about 500 to about 10,000.
An abrasive composition comprising abrasive particles and a polyelectrolyte having ionic moieties of a charge that differs from that associated with said abrasive particles and wherein the concentration of said polyelectrolyte is about 5 to about 50 percent by weight of said abrasive particles and wherein said polyelectrolyte has a molecular weight of about 1000 to about 5000.
A method for polishing a surface which comprises providing on said surface a slurry comprising abrasive particles and exhibiting normal stress effect and further comprising a polyelectrolyte having ionic moieties of a charge that differs from that associated with said abrasive particles and wherein the concentration of said polyelectrolyte is about 5 to about 50 percent by weight of said abrasive particles and wherein said polyelectrolyte has a molecular weight of about 500 to about 10,000.
A method for polishing a surface which comprises providing on said surface a slurry comprising abrasive particles and a polyelectrolyte having ionic moieties of a charge different from that associated with said abrasive particles and wherein the concentration of said polyelectrolyte is about 5 to about 50 percent by weight of said abrasive particles;
- and planarizing said surface by contacting it with a polishing pad and wherein said polyelectrolyte has a molecular weight of about 500 to about 10,000.
Dependencies are inferred from the claim text.