Multi chip module cooling apparatus

A multi chip module cooling apparatus comprising:

• a cold plate cooling a multi chip module mounted thereon by means of a refrigerant contained therein, said cold plate including a sealed housing in which a refrigerant vapor outlet and a refrigerant inlet are formed at upper and lower ends, respectively, and a vertical baffle movably mounted in said housing and dividing said interior space of said housing;
• a condensing means for condensing a hot refrigerant vapor vaporized in said cold plate by means of a cooling water flowed therein, said condensing means formed of a metal block in which a refrigerant vapor flow means is formed in one side and a cooling water flow means is formed in opposite to said refrigerant vapor flow means;
• and
• a pair of circulating tubes connecting said cold plate and said condensing means as a circulation loop shape, said circulating tubes including a refrigerant vapor flow tube connecting said refrigerant vapor outlet of said cold plate with said refrigerant vapor flow means of said block for supplying a hot refrigerant vapor discharged through said refrigerant vapor outlet to said condensing means, and a refrigerant flow tube connecting said refrigerant vapor flow means of said block with said refrigerant inlet of said cold block for supplying a refrigerant condensed and cooled at said condensing means to said cold plate by means of gravity;
• wherein, a thermosyphonic action occurs in said interior space defined by said baffle within said sealed housing of said cold plate when said refrigerant absorbs heat from said multi chip module, by which said refrigerant is vaporized and flows into said refrigerant vapor flow means of said block through said refrigerant vapor flow tube.