Semiconductor device including a main alignment mark having peripheral minute alignment marks
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorKimio Hagi
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Abstract
In a semiconductor device having alignment marks formed on a semiconductor substrate, the alignment marks include a main convex or concave alignment mark formed on said semiconductor substrate; and a plurality of minute alignment marks formed on the periphery of the main alignment mark. In areas where the minute alignment marks are formed, even when a film of aluminum or its alloy is stacked on the semiconductor substrate by high temperature sputtering, grains will not grow so as to have a large diameter. Thus, the grains created on the periphery of the main alignment mark are not erroneously recognized as the main alignment mark, thereby realizing accurate alignment.
Claims8
A semiconductor device having alignment marks formed on a semiconductor substrate, said alignment marks comprising:
- a main alignment mark formed on the semiconductor substrate;
- and
- minute alignment marks located on the outer periphery of the main alignment mark such that the growth of grains on the minute alignment marks is suppressed.
A semiconductor device having alignment marks formed on a semiconductor substrate, said alignment marks comprising:
- a main alignment mark formed on said semiconductor substrate in at least one of convex and concave shapes;
- and
- a plurality of minute alignment marks located on the periphery of the main alignment mark such that the growth of grains on the minute alignment marks is suppressed.
A semiconductor device having alignment marks formed on a semiconductor substrate, said alignment marks comprising:
- a main alignment mark formed on the semiconductor substrate, said main alignment mark having a width;
- and
- a plurality of minute alignment marks located on the outer periphery of the main alignment marks, each of said plurality of minute alignment marks having a width differing from the width of said main alignment mark.
A semiconductor device having alignment marks formed on a semiconductor substrate, said alignment marks comprising:
- a plurality of elongated main alignment marks formed on the semiconductor substrate in a parallel arrangement;
- and
- a plurality of minute alignment marks extending laterally from on the outer periphery of at least one of said main alignment marks so as to form a lattice shaped configuration with said plurality of elongated main alignment marks.
Dependencies are inferred from the claim text.