Alternative silicon chip geometries for integrated circuits

A method of producing an integrated circuit, the method comprising the following steps:

• providing a triangularly shaped I/O region on the periphery of said integrated circuit;
• providing a core region within said triangularly shaped I/O region;
• providing said triangularly shaped I/O region with I/O slots having trapezoidal shapes;
• and
• providing a first area within said triangularly shaped I/O region, the first area being located between the core region and the trapezoidally shaped I/O slots, wherein the first area is arranged to separate the core region and the trapezoidally shaped I/O slots.

An integrated circuit comprising:

• a core region;
• a triangularly shaped I/O region surrounding said core region, said triangularly shaped I/O region having a plurality of I/O slots having trapezoidal shapes, wherein a first I/O slot selected from the plurality of I/O slots has a first side and a second side, the first side of the first I/O slot being substantially parallel to the second side of the first I/O slot, and wherein a second I/O slot selected from the plurality of I/O slots has a first side and a second side, the first side of the second I/O slot being substantially parallel to the second side of the second I/O slot and substantially opposite of the first side of the first I/O slot;
• and
• a plurality of I/O bonding pads within said triangularly shaped I/O region, wherein a first I/O bonding pad selected from the plurality of I/O bonding pads is positioned substantially adjacent to the second side of the first I/O slot and a second I/O bonding pad selected from the plurality of I/O bonding pads is positioned substantially adjacent to the second side of the second I/O slot.