US 5,858,254 A · Multilayered circuitized substrate and method of fabrication

Abstract

A multilayer circuit fabrication approach and circuitized substrate are presented wherein at least two conductive layers are formed over a substrate. The conductive layers are separated by a first dielectric layer and the structure is encapsulated with a second dielectric layer. The first dielectric layer includes open areas exposing a portion of the underlying support structure aligned to those areas where contact points are to reside in the second conductive layer. The first dielectric layer comprises a blanket dielectric layer such that recesses are defined in the upper surface thereof aligned to the open areas of the first conductive layer. The second conductive layer thus resides in two planes, both of which comprise planes other than a plane of the first conductive layer. A plurality of openings can be simultaneously formed to expose contact points in both the first and second conductive layers.

Claims20

Dependent claims

A method for fabricating a multilayered circuit comprising:

(a) providing a substrate;
(b) forming a first patterned conductive layer over the substrate, said first patterned conductive layer having an open area therein;
(c) providing a first dielectric layer on the first patterned conductive layer and into the open area of the first patterned conductive layer;
(d) providing a second patterned conductive layer on the first dielectric layer, said second patterned conductive layer having an open area exposing a portion of said first dielectric layer;
(e) providing a second dielectric layer over said second patterned conductive layer and said exposed portion of said first dielectric layer;
and
(f) providing openings in said second dielectric layer and in both said second and first dielectric layers to expose selected portions of said second patterned conductive layer and said first patterned conductive layer, respectively.

4 more elements

Dependencies are inferred from the claim text.

Multilayered circuitized substrate and method of fabrication

Life of this patent

Multilayered circuitized substrate and method of fabrication

Life of this patent

Abstract

Claims20