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US 5,857,576 AGranted
Wafer carrier with an anti-slip surface
AssigneeSamsung Electronics Co., Ltd.
InventorsMoon-Kwan Kim, Dong-Myung Park
Life of this patent
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Abstract
A wafer carrier having an anti-slip structure formed on outward surface portions of side plates of the wafer carrier. The anti-slip structure may be composed of at least one of several shapes or structures such as grooves, round shape projections, and acute angle shaped projections, each which is formed on both the outward surface portions. The wafer carrier having such an anti-slip structure prevents the wafer carrier from slipping or falling while the wafer carrier is being transported.
Claims11
A wafer carrier for transporting semiconductor wafers residing therein, comprising:
- a carrier body having a pair of opposing side plates joined to a bottom plate therebetween, and an inner curved surface extending from a first lateral edge of one of the side plates, along the bottom plate, and to a second lateral edge of the other of the side plates;
- slots located in the inner curved surface of the body extending generally continuously from the first lateral edge to the second lateral edge, for receiving the wafers in an upright position, said slots having a bottom wall and opposing side walls;
- and
- a plurality of undulations disposed along a substantial vertical extent of an outward surface of each of the side plates, whereby the wafer carrier may be safely transported to another location.
1 more element
Dependencies are inferred from the claim text.