Vertically stacked circuit module using a platform having a slot for establishing multi-level connectivity
AssigneePacesetter, Inc.
InventorAlvin H. Weinberg
Life of this patent
Estimating the term…
Abstract
A circuit module for use in an implantable cardiac stimulation device contains a plurality of stacked substrate platforms. Electrical components of a hybrid circuit structure are attached to respective mounting surfaces of the substrate platforms. Electrical connectivity between components mounted on separate platform levels is established by connecting the components via wire bonds or other means. The wire bonds pass through a slot formed in an upper level substrate and are attached to electrical contacts of an associated lower level substrate.
Claims22
A cardiac stimulation device for monitoring the heart activity of a patient upon surgical implantation of the cardiac stimulation device within the patient, the cardiac stimulation device comprising:
- a housing containing a battery and a vertically stacked electronics module for monitoring cardiac activity of the patient, the electronics module comprising:
- a lower level substrate having a first electrical component mounted on a top surface thereon;
- an upper level substrate raised above and attached to the lower level substrate and having a top surface with a second electrical component mounted thereon, the upper level substrate having a bottom surface covering the first electrical component;
- and
- a plurality of wire bonds electrically connecting the first and second electrical components of the lower and upper level substrates wherein the plurality of wire bonds are disposed within an aperture formed through the upper level substrate.
A cardiac stimulation device for monitoring the heart activity of a patient upon surgical implantation of the cardiac stimulation device within the patient, the cardiac stimulation device comprising:
- a housing containing a battery and a vertically stacked electronics module for monitoring cardiac activity of the patient, the electronics module comprising:
- a first substrate platform having a first plurality of electronic components mounted on a top surface thereon;
- a second substrate platform raised above and attached to the first substrate platform and formed with at least one aperture therethrough, the second substrate platform having a bottom surface covering the first plurality of components and having a second plurality of electronic components mounted on a top surface thereon;
- and
- wire bonds traversing the at least one aperture for establishing electrical connectivity between at least one component of the first plurality of electronic components and at least one component of the second plurality of electronic components.
An electronics module for use in a cardiac stimulation device wherein the electronics module is mounted within a housing of the cardiac stimulation device, said electronics module comprising:
- a first substrate having a first group of electronic components mounted on a surface of the first substrate, the first substrate having a first set of contacts in electrical communication with the first group of electronic components;
- a second substrate formed as a raised platform having exterior edges acting as platform supports and further having an aperture therethrough the second substrate being mounted on the surface of the first substrate, the second substrate having a second set of contacts in electrical communication with a second group of electronic components mounted on a top surface of the second substrates whereby the second substrate is situated between the first and second group of electronic components;
- and
- a plurality of wire bonds individually connected between respective pairs of contacts between the first and second sets of contacts, wherein the plurality of wire bonds are partially disposed within the aperture formed through the second substrate.
A method of constructing a vertically stacked electronic circuit module for use in a cardiac stimulation device comprising the following steps:
- providing a first substrate for mounting a first group of electrical components on a top surface thereon;
- providing a second substrate characterized by an aperture therethrough;
- attaching the second substrate to the top surface of the first substrate, the second substrate comprising platform supports for contacting the first substrate, a bottom surface resting on the platform supports and elevated above the first substrate, and a top surface for mounting a second group of electrical components thereon;
- connecting at least one wire bond between at least one contact of the first group of electrical components and at least one contact of the second group of electrical components wherein the at least one wire bond traverses the aperture of the second substrate to form a vertically stacked interconnected circuit;
- and
- attaching a cover to the top surface of the second substrate for confining the first and second groups of electrical components.
Dependencies are inferred from the claim text.