Chemical-sensitization positive-working photoresist composition

A chemical sensitization-type positive-working photoresist composition which consists essentially of, as a uniform blend:

• (a) from 1 to 20 parts by weight of a compound capable of generating an acid by the irradiation with actinic rays;
• (b) 100 parts by weight of a polymeric resin which is imparted with increased solubility in an aqueous alkaline solution in the presence of an acid;
• and
• (c) from 0.5 to 20 parts by weight of an esterification product between a phenolic compound having a molecular weight not exceeding 1000 and a naphthoquinone-1,2-diazide sulfonic acid, which serves as a halation inhibitor, wherein the phenolic compound is represented by the formula ##STR10## in which R is a methyl or cyclohexyl group, R' and R" are each a hydrogen atom or methyl group and the subscript m is 1 or 2.

A chemical sensitization-type positive-working photoresist composition which consists essentially of, as a uniform blend:

• (a) from 1 to 20 parts by weight of a compound capable of generating an acid by the irradiation with actinic rays;
• (b) 100 parts by weight of a polymeric resin which is imparted with increased solubility in an aqueous alkaline solution in the presence of an acid;
• and
• (c) from 0.5 to 20 parts by weight of an esterification product between a phenolic compound having a molecular weight not exceeding 1000 and a naphthoquinone-1,2-diazide sulfonic acid, which serves as a halation inhibitor, wherein the phenolic compound is represented by the formula ##STR11## in which R.sup.1, R.sup.2 and R.sup.3 are each a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R.sup.4 to R.sup.7 are each a group or atom selected from the group consisting of a hydrogen atom, halogen atoms, alkyl groups having 1 to 4 carbon atoms, alkoxy groups having 1 to 4 carbon atoms, alkenyl groups having 2 to 4 carbon atoms and cyclohexyl group, R.sup.8 and R.sup.9 are each a hydrogen atom, halogen atom or alkyl group having 1 to 4 carbon atoms, Q is a hydrogen atom, alkyl group having 1 to 4 carbon atoms or a phenolic group represented by the formula ##STR12## R.sup.10 and R.sup.11 each being a group or atom selected from the group consisting of a hydrogen atom, halogen atoms, alkyl groups having 1 to 4 carbon atoms, alkoxy groups having 1 to 4 carbon atoms, alkenyl groups having 2 to 4 carbon atoms and cyclohexyl group and the subscript z being 1, 2 or 3, the subscripts x and y are each 1, 2 or 3 and the subscript n is 0 or 1.

A chemical sensitization-type positive-working photoresist composition which consists essentially of, a uniform blend:

• (a) from 1 to 20 parts by weight of a compound capable of generating an acid by the irradiation with actinic rays;
• (b) 100 parts by weight of a polymeric resin which is imparted with increased solubility in an aqueous alkaline solution in the presence of an acid;
• and
• (c) from 0.5 to 20 parts by weight of an esterification product between a phenolic compound having a molecular weight not exceeding 1000 and a naphthoquinone-1,2-diazide sulfonic acid, which serves as a halation inhibitor, wherein the phenolic compound is 1-›1-(4-hydroxyphenyl) isopropyl!-4-›1,1-bis(4-hydroxyphenyl)ethyl! benzene.