US 5,855,954 AGranted

Composite structure for manufacturing a microelectronic component and a process for manufacturing the composite structure

AssigneeDaimler-Benz Aktiengesellschaft

InventorsTim Gutheit, Reinhard Zachai, Eckart Bottger

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Abstract

The invention provides a composite structure for microelectronic components having a self-supporting metal plate, an electrically insulating layer adhering to the metal plate, and a functional layer adhering to the insulating layer for the application of at least one microelectronic component. An at least largely monocrystalline information layer which covers the metal plate at points is applied to the self-supporting metal plate. The regions of the surface of the metal plate which are free of the information layer are provided with the insulating layer. When the surface of the information layer is exposed at least in regions, the functional layer is deposited on the insulating layer and on the exposed information layer. The crystal information required for an epitaxial deposition of the functional layer is taken from the information layer.

Claims13

Dependent claims

Process for manufacturing a multi-layer composite structure, in which an electrically isolating insulating diamond layer comprising one of a diamond material and a diamond-like carbon material is deposited on a metallic layer, with a functional layer comprising a crystalline semiconductor material arranged on the diamond layer, for the later application of at least one microelectronic component, said process comprising the steps of:

providing a self-supporting metal plate as a metallic layer;
applying to the metal plate an at least largely monocrystalline information layer which covers at least one area of the metal plate;
applying a polycrystalline diamond insulating layer at least to regions of the surface of the metal plate which are outside of the at least one area covered by the information layer, at least regions of a surface of the information layer being left free;
and
depositing a functional layer which is free of diamond and free of diamond-like carbon directly on the diamond layer and on free regions of the information layer by means of epitaxial deposition according to crystal information from the information layer.

2 more elements

Process for manufacturing a microelectronic component arrangement comprising a functional layer which contains a microelectronic component, and an electrically insulating layer, said arrangement having a self supporting metal plate, an insulating layer deposited on the self-supporting metal plate, by means of at least one of chemical vapor deposition from a gas phase, and electrolytically, and an electrically insulating layer which is a good conductor of heat arranged between the metal plate and the functional layer, said insulating layer contacting and adhering directly to the metal plate and with the functional layer, said process comprising the steps of:

providing a self-supporting metal plate as a metallic layer;
applying to the metal plate an at least largely monocrystalline information layer which covers at least an area of the metal plate;
applying a polycrystalline diamond insulating layer at least to regions of the surface of the metal plate which are outside of the at least one area covered by the information layer, at least regions of a surface of the information layer being left free;
and
depositing a functional layer which is free of diamond and free of diamond-like carbon directly on the diamond layer and on the free information layer, by means of epitaxial deposition according to crystal information from the information layer;
wherein
the microelectronic component is applied via the functional layer;
and
a component root of the microelectronic component, comprising a surface covered by the microelectronic component on at least the functional layer, is arranged at least in regions above at least one of the functional layer and the insulating layer, which regions are free of the information layer.

6 more elements

Dependencies are inferred from the claim text.