Plasma thin-film forming apparatus

A plasma thin-film forming apparatus comprising:

• a vacuum vessel;
• a positive and a negative electrode disposed in said vacuum vessel so that the discharge surfaces may face each other at a required interval;
• an exhaust means for making a required vacuum condition in the interior of said vacuum vessel;
• a high-voltage impressing means for generating DC glow discharge by impressing high voltage between said positive and said negative electrode;
• a gas-inducting means for supplying metal compound-including gas into said vacuum vessel;
• said gas-inducting means comprising a flexible holding member gastightly fitted to a sublimation chamber communicating with said vacuum vessel and having a hollow portion therein and a glass container inserted in the hollow portion of said holding member and enclosing a predetermined quantity of crystallized osmium tetraoxide therein;
• said gas-inducting means which is capable of inducting osmium gas into said vacuum vessel by elastically deforming said holding member to break said glass container in the required vacuum condition of said vacuum vessel set by said exhaust means after fitting said holding member with said glass container inserted in the hollow portion to said sublimation chamber;
• and
• said exhaust means provided with a material gas-adsorbing means in the exhaust port for adsorbing and collecting the osmium gas contained in the exhausted air out of said vacuum vessel.