Epoxy resin composition
AssigneeToray Industries, Inc.
InventorsKen Shimizu, Yasushi Sawamura, Masayuki Tanaka
Life of this patent
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Abstract
An epoxy resin composition composed of an epoxy resin (A), a hardener (B), and an inorganic filler (C), characterized in that the content of the inorganic filler (C) is 70-97 wt % and the inorganic filler (C) contains 0.1-50 wt % of alumina. When used to seal semiconductor devices, it exhibits good moldability and imparts to the sealed semiconductors good flame retardance, solder heat resistance, and reliability at high temperatures.
Claims14
An epoxy resin composition composed of an epoxy resin (A), a hardener (B), and an inorganic filler (C) containing silica and alumina as an essential component, characterized in that said epoxy resin (A) contains as an essential component a biphenyl type epoxy resin having the structure represented by the formula (I) below:
- ##STR3## where R.sup.1 to R.sup.8 each denote a hydrogen atom, a halogen atom, or a C.sub.1-4 alkyl group, and wherein the content of the inorganic filler (C) is 70-97 wt %, based on the total weight of the composition, and the inorganic filler (C) contains 0.1-20 wt % of alumina.
A semiconductor device sealed with an epoxy resin composition as defined in claims 1 or 8.
An epoxy resin composition composed of an epoxy resin (A), a hardener (B), and an inorganic filler (C) containing silica and alumina as an essential component, characterized in that the content of the inorganic filler (C) is 87-97 wt %, based on the total weight of the composition, and the inorganic filler (C) contains 0.1-50 wt % of alumina, and further characterized in that said epoxy resin (A) contains as an essential component a biphenyl type epoxy resin having the structure represented by the formula (1) below:
- ##STR4## where R.sup.1 to R.sup.8 each denote a hydrogen atom, a halogen atom, or a C.sub.1-4 alkyl group.
A process for producing an epoxy resin composition, said process comprising melt-mixing an epoxy resin (A), a hardener (B), and an inorganic filler (C) containing silica and 0.1-20 wt % of alumina, the amount of (C) being 70-97 wt % of the total amount of the resin composition, said epoxy resin (A) containing as an essential component a biphenyl type epoxy resin having the structure represented by the formula I below:
- ##STR5## where R.sup.1 to R.sup.8 each denote a hydrogen atom, a halogen atom, or a C.sub.1-4 alkyl group.
A process for producing an epoxy resin composition, said process comprising melt-mixing an epoxy resin (A), a hardener (B), and an inorganic filler (C) containing silica and 0.1-50 wt % of alumina, the amount of (C) being 87-97 wt % of the total amount of the resin composition, said epoxy resin (A) containing as an essential component a biphenyl type epoxy resin having the structure represented by the formula (I) below:
- ##STR6## where R.sup.1 to R.sup.8 each denote a hydrogen atom, a halogen atom, or a C.sub.1-4 alkyl group.
Dependencies are inferred from the claim text.