Process for manufacturing metal plane support for multi-layer lead frames

A process for making a multi-layer lead frame for semiconductor devices, comprising the steps of:

• a) preparing a lead-frame support made of a single thin metal strip having a plurality of lead frames continuously arranged in a longitudinal direction, and including a metal plane support made of a single thin metal strip and including a plurality of metal planes continuously arranged in the longitudinal direction corresponding to the plurality of lead frames, a pair of side rails extending co-planar with the metal planes in the longitudinal direction, for supporting the plurality of metal planes therebetween, first connectors between the metal planes and the side rails, and second connectors between the side rails and bars extending between the side rails, the first and second connectors including breakable portions;
• b) laminating the metal plane support to the lead frame support utilizing insulating adhesive tapes;
• c) gripping the side rails;
• d) bending the side rails at the breakable portions within an arc including a first gripping position co-planar with the metal planes and a second position non-planar with the metal planes to break the breakable portions;
• and
• e) removing the side rails from the metal planes and bars.