Method for spray-cooling a tunable semiconductor device
AssigneeMotorola, Inc.
InventorsLoren F. Root, Kevin J. McDunn
Life of this patent
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Abstract
The method includes providing a substrate (18) having a semiconductor die (12) thereon, the semiconductor die having a major surface (23); disposing an input region (24) an active region (32) and a conductive region (34) on the major surface, the conductive region electrically coupling the input region and the active region; providing an inductive metal region (42) in communication with the input region, the inductive metal region sized to allow real-time iterative tuning of the electronic device; and receiving a fluid by a nozzle (60), the nozzle atomizing the fluid and discharging the fluid onto the major surface.
Claims3
A method for spray-cooling an electronic device, comprising the steps of:
- providing a substrate having a semiconductor die thereon, the semiconductor die having a major surface;
- disposing an input region, an active region and a conductive region on the major surface, the conductive region electrically coupling, the input region and the active region;
- providing an inductive metal region in communication with the input region, the inductive metal region sized to allow real-time iterative tuning of the electronic device;
- and
- receiving a fluid by a nozzle, the nozzle atomizing the fluid and discharging the fluid onto the major surface.
Dependencies are inferred from the claim text.