Method of processing substrate and apparatus for processing substrate
AssigneeTokyo Electron Limited
InventorsMitsuhiro Sakai, Kiyohisa Tateyama
Life of this patent
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Abstract
A method of processing a substrate having the steps of placing a substrate for forming an LCD on a support, mounting a cover on the substrate in such a manner that a clearance is formed from at least either surface of the substrate placed on the support, introducing developer or pure water into the clearance, bringing the developer or pure water into contact with at least either surface of the substrate, processing the substrate with the developer or pure water, removing the cover from the substrate, and discharging the substrate from the support.
Claims8
A method of processing a large-sized substrate, used to form a liquid crystal display, utilizing a treatment liquid including a developing solution or a rinsing solution, comprising the steps of:
- (a) loading a substrate onto a support;
- (b) mounting a cover on the substrate in such a manner that a clearance is formed from at least either surface of the substrate placed on said support;
- (c) introducing the treatment liquid into said clearance through either side of said cover and discharging the treatment liquid from said clearance to another side of said cover to cause the treatment liquid to flow in said clearance while forming a laminar flow parallel to at least either surface of the substrate, thereby bringing at least said either surface of the substrate into contact with the flowing treatment liquid;
- (d) removing said cover from the substrate;
- and
- (e) unloading the substrate from said support.
Dependencies are inferred from the claim text.