Method of coating a sputter cathode with a layer of material to be applied to a substrate by sputtering
AssigneeEmiel Vanderstraeten
InventorJohan Vanderstraeten
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Abstract
This invention is relating to a sputter cathode (1) with a layer of material that is applied to a substrate by sputtering, wherein this layer (3) contains low electrical conductivity particles (3a) of which a certain quantity are at least coated by a film (3b) of electrically conductive material, or which form an aggregate with a conductive material, so as to give this layer (3) sufficient electrical conductivity to be able to be applied to the substrate by means of sputtering.
Claims18
A method for coating of a sputter cathode with a layer of material that is to be applied to a substrate by means of sputtering, said method comprising the steps of:
- a) forming conductive particles consisting of silicon particles coated with a conductive film selected from the group consisting of aluminum, nickel and an aluminum-nickel alloy;
- and
- b) vacuum plasma-metal spraying said particles on to an electrically conductive carrier to form a layer of material that can be applied to a substrate by means of sputtering.
Dependencies are inferred from the claim text.