Integrated circuit and method for forming and integrated circuit
AssigneeMicron Technology, Inc.
InventorJ. Brett Rolfson
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AssigneeMicron Technology, Inc.
InventorJ. Brett Rolfson
Estimating the term…
A method for forming an integrated circuit comprising providing a substrate comprising a node to which electrical connection is to be made; providing a layer of material outwardly of the node; and providing an electrically conductive plug through the layer of material and in electrical connection with the underlying node, the layer of material and conductive plug forming an interlocking discontinuity which effectively prevents displacement of the electrical conductive plug from the node. The present invention also contemplates an integrated circuit wherein an interlocking discontinuity comprises a projection which extends laterally outwardly relative to an electrically conductive plug, or a projection which extends laterally outwardly from a layer of material into an electrically conductive plug.
A method for forming an integrated circuit comprising:
A method for forming an integrated circuit comprising:
A method for forming an integrated circuit comprising:
Dependencies are inferred from the claim text.