US 5,851,910 A · Method of fabricating a bonding pad window

Abstract

A method of fabricating a bonding pad window, includes providing a substrate, which is metallized with a first metallization layer; forming a dielectric layer over the first metallization layer; defining the dielectric layer with a first mask to form a via; forming a plug in the via; forming a second metallization layer over the plug and the dielectric layer; patterning the second metallization layer to expose the dielectric layer; forming a passivation layer over the second metallization layer; and defining the passivation layer with the first mask to form the bonding pad window. This improves and simplifies the formation of a bonding pad window. For example, the process of forming a mask, which is used to form the bonding pad window, can be omitted. The previous via mask is used to form the bonding pad window and the internal circuit probing window at the same time.

Claims9

Dependent claims

A method of fabricating a bonding pad window, comprising:

providing a substrate metallized with a first metallization layer;
forming a dielectric layer over the first metallization layer;
defining the dielectric layer using a first mask to form a via;
forming a plug in the via;
forming a second metallization layer over the plug and the dielectric layer;
forming a silicon nitride layer over and directly on the second metallization layer;
defining the second metallization layer and the silicon nitride layer by patterning and etching to expose the dielectric layer;
forming a passivation layer over and directly on the dielectric layer;
and
forming a bonding pad window in registration with the plug by etching the silicon nitride layer to expose the second metallization layer.

7 more elements

Dependencies are inferred from the claim text.

Method of fabricating a bonding pad window

Life of this patent

Method of fabricating a bonding pad window

Life of this patent

Abstract

Claims9