Gas injection system for semiconductor processing
AssigneeWatkins-Johnson Company
InventorsLydia J. Young, Richard H. Matthiesen, Simon Selitser, Ron van Os
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Abstract
A system for injecting a gaseous substance into a semiconductor processing chamber. The injection system includes at least one plenum formed in a plenum body and a plurality of nozzles associated with each plenum for injecting gaseous substances from the plenums into the chamber. A conduit structure transports gaseous substances along an indirect path from the plenum to the nozzles. The nozzles are positioned and configured to provide a uniform distribution of gaseous substances across the wafer surface.
Claims22
A gas injection system for delivering a gaseous substance to a semiconductor processing chamber comprising:
- a plenum body mountable in a processing chamber and having at least one plenum formed therein, said plenum having at least one supply inlet for delivery of a gaseous substance to said plenum,
- a plurality of nozzles for injecting said gaseous substance into the processing chamber, said nozzles being spaced from said plenum, and
- a plurality of indirect conduits each extending between said plenum and at least one of said nozzles for transporting said gaseous substance along an indirect path from said plenum to said nozzles, said indirect conduits directing the flow of said gaseous substance in at least two different flow directions to interrupt the flow of said gaseous substance between said plenum and said nozzle such that said gaseous substance in uniformly transported from said plenum to said nozzle independent of the location of said nozzles relative to said supply inlet.
A system for injecting a gaseous substance into a chamber for semiconductor processing comprising:
- a plenum body having a plurality of plenums formed therein, said plenums each having a supply inlet for delivery of a gaseous substance thereto,
- a plurality of first nozzles coupled to a first one of said plenums for injecting said gaseous substance into said processing chamber, said first nozzles being oriented at a first angle relative to a horizontal plane to inject said gaseous substance supplied to said first plenum toward the edge of a substrate located on the same side of the chamber as said first nozzle, and
- a plurality of second nozzles coupled to a second one of said plenums for injecting said gaseous substance into said processing chamber, said second nozzles being oriented at a second angle relative to a horizontal plane to inject said gaseous substance supplied to said second plenum toward the edge of the substrate located on the opposite side of the chamber from said second nozzle.
A gas injection system for delivering a gaseous substance to a semiconductor processing chamber comprising:
- a plenum body mountable in a processing chamber and having at least one plenum formed therein, said plenum having at least one supply inlet for delivery of a gaseous substance to said plenum,
- a plurality of nozzles for injecting said gaseous substance into the processing chamber, said nozzles being spaced from said plenum, and
- a plurality of indirect conduits extending between said plenum and said nozzles for transporting said gaseous substance along an indirect path configured to interrupt the flow of said gaseous substance such that said gaseous substance is uniformly distributed to said nozzles independent of the location of said nozzle relative to said supply inlet, said indirect conduits including at least a first channel and a second channel, said first channel extending from said plenum in a first direction and said second channel extending from said second channel in a second direction oriented at an angle relative to the first direction.
Dependencies are inferred from the claim text.