Substrate heating equipment for use in a semiconductor fabricating apparatus
AssigneeKokusai Electric Corporation
InventorsIssei Makiguchi, Katsuyoshi Hamano, Tokunobu Akao
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Abstract
A substrate heating equipment for use in a semiconductor fabricating apparatus includes a heater support frame disposed within a vacuum vessel, opposed panel heaters disposed in a pluri-shelved fashion within the heater support frame, and support means for supporting a substrate to be treated between an adjacent pair of the opposed panel heaters, whereby simultaneous heating of plural substrates to be treated is enabled. By controlling the individual temperature of the panel heaters, it also becomes possible to significantly reduce a tact time and to effect uniform heating of the substrates while the equipment is rendered compact.
Claims15
A substrate heating equipment for use in a semiconductor fabricating apparatus, comprising a heater support frame disposed within a vacuum vessel, a plurality of opposed panel heaters individually temperature controlled and disposed in a plural shelved fashion within said heater support frame, and support means for supporting a substrate to be treated between an adjacent pair of said opposed panel heaters.
Dependencies are inferred from the claim text.