Semiconductor chip package
AssigneeNEC Corporation
InventorMasaaki Abe
Life of this patent
Estimating the term…
Abstract
A semiconductor chip package is produced using a lead frame which has an island where a plurality of through holes are formed corresponding to the electrodes of the semiconductor chip, respectively. After an insulating film is formed on the island, the semiconductor chip is fixed to one side of the island through an adhesive layer while aligning the electrodes of the semiconductor chip with the through holes of the island portion, respectively. After sealing the semiconductor chip with sealing resin, solder balls are formed on the other side of the island portion, the solder balls are connected to the electrodes of the semiconductor chip through the through holes of the island portion, respectively.
Claims13
A method for producing a semiconductor chip package including a semiconductor chip having a plurality of electrodes arrayed in a predetermined pattern on one side thereof, comprising the steps of:
- insulating a metal film having an island portion where a plurality of through holes are formed corresponding to the electrodes of the semiconductor chip, respectively, such that at least the island portion having the through holes therein is insulated;
- bonding the semiconductor chip to one side of the island portion such that the electrodes of the semiconductor chip are aligned with the through holes of the island portion, respectively;
- and
- forming a plurality of terminals on the other side of the island portion, the terminals being connected to the electrodes of the semiconductor chip through the through holes of the island portion, respectively.
A method for producing a semiconductor chip package including a semiconductor chip having a plurality of electrodes arrayed in a predetermined pattern on one side thereof, comprising the steps of:
- preparing a lead frame having an island portion where a plurality of through holes are formed corresponding to the electrodes of the semiconductor chip, respectively;
- forming an insulating film on at least the island portion having the through holes therein;
- fixing the semiconductor chip to one side of the island portion of the lead frame through an adhesive layer such that the electrodes of the semiconductor chip are aligned with the through holes of the island portion, respectively;
- sealing the semiconductor chip with sealing resin;
- and
- forming a plurality of terminals on the other side of the island portion, the terminals being connected to the electrodes of the semiconductor chip through the through holes of the island portion, respectively.
Dependencies are inferred from the claim text.