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US 5,849,582 AGranted
Baking of photoresist on wafers
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChao-Chen Chen, Wei-Kay Chiu
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Abstract
A method and apparatus for curing a photoresist that is deposited in liquid form and spun on a surface of a wafer leaving a thin film to be cured. This invention teaches methods for curing the resist with improved thickness control using front side heating.
Claims5
A method of hardening an emulsion on a surface of a substrate that has been actinically pattern exposed and developed, comprising the steps of:
- providing an emulsion hardening chamber with a radiant heat source;
- providing a vacuum chuck apparatus inside said chamber, said chuck apparatus having a vertical and rotatable chuck holding surface;
- placing said substrate vertically and securing it to said vacuum chuck holding surface;
- directing radiant heat to harden said emulsion;
- cooling said substrate;
- and
- removing said substrate from said vacuum chuck holding surface.
4 more elements
Dependencies are inferred from the claim text.