Method for forming a thin uniform layer of resist for lithography
AssigneeMicron Technology, Inc.
InventorsSalman Akram, Paul Shirley, William Rericha
Life of this patent
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Abstract
A method for forming a layer of resist on a non-planar substrate includes the steps of: dispensing resist onto the substrate; spinning the substrate to spread the resist; and then vibrating the substrate to eliminate voids in the resist. Optionally, the substrate can be inverted and vibrated at the same time to distribute the resist over the sidewalls of any projections or plateaus on the non-planar substrate. Following the vibrating and optional inversion steps, the resist is partially hardened, an edge bead is removed and a backside of the resist is washed. These steps are followed by soft bake, exposure and development of the layer of resist.
Claims32
A method for forming a layer of resist on a non-planar substrate comprising:
- dispensing resist onto the substrate;
- spinning the substrate to spread the resist;
- vibrating the substrate;
- inverting the substrate during or following the vibrating step;
- removing an edge bead of resist from the substrate;
- and
- heating the resist.
A method for forming a layer of resist on a non-planar substrate comprising:
- dispensing resist onto the substrate;
- spinning the substrate;
- vibrating the substrate;
- and
- back side washing the substrate during or following the vibrating step.
A method for forming a layer of resist on a non-planar substrate comprising:
- dispensing resist onto the substrate;
- spinning the substrate to spread the resist;
- vibrating the substrate;
- removing an edge bead from the resist;
- washing a backside of the substrate;
- and
- heating the resist.
A method for forming a layer of resist on a non-planar substrate comprising:
- dispensing resist onto the substrate;
- spinning the substrate to distribute the resist over the substrate;
- vibrating the substrate at a frequency of about one to 5000 cycles per second;
- inverting the substrate;
- and
- removing an edge bead from the resist and washing a backside of the substrate.
A method for forming a layer of resist comprising:
- providing a substrate comprising a layer with a non-planar topography;
- dispensing resist onto the substrate;
- spinning the substrate to spread the resist over the substrate;
- vibrating the substrate at a frequency of from one to 5000 cycles per second;
- removing an edge bead of resist and washing a backside of the substrate;
- following the removing step, heating the resist;
- exposing the resist;
- developing the resist to form a resist mask;
- and
- etching the layer using the resist mask.
A method for forming a layer of resist on an interconnect for semiconductor dice, said method comprising:
- providing a substrate comprising a plurality of raised projections at least partially covered with a layer;
- dispensing resist onto the substrate;
- spinning the substrate to spread the resist over the substrate;
- vibrating the substrate at a frequency of from one to 5000 cycles per second;
- removing an edgebead of resist and washing a backside of the substrate;
- following the removing step,
- heating the resist;
- exposing the resist;
- developing the resist to form a resist mask;
- and
- etching the layer using the resist mask.
A method for forming a layer of resist on a substrate having a non-planar topography comprising:
- dispensing resist onto the substrate;
- spinning the substrate;
- vibrating the substrate at a frequency of from one to 5000 cycles per second;
- and
- inverting the substrate following the vibrating step.
Dependencies are inferred from the claim text.