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US 5,848,889 AGranted
Semiconductor wafer support with graded thermal mass
AssigneeApplied Materials, Inc.
InventorsJames V. Tietz, Benjamin Bierman, David S. Ballance
Life of this patent
Estimating the term…
Abstract
An annular-shaped edge ring support for a semiconductor wafer has an innermost radial portion for supporting the semiconductor wafer and an outermost radial portion contiguous with the inner portion. The inner portion has a graded thermal mass that generally increases with increasing radius.
Claims27
A thermal apparatus for processing a substrate comprising:
- an edge ring support which supports an outer periphery of the substrate and which has an open center region, said edge ring support including an inner portion that surrounds the open center region and on which the outer periphery of the substrate rests during operation, the inner portion having a graded thermal mass that increases with outward radial distance from an inner edge;
- and
- a heat source positioned directly opposite the open central region of the edge ring support so as to radiate heat energy directly onto a surface of the substrate during operation.
A thermal apparatus for processing a substrate comprising:
- an annular edge ring support on which the substrate rests during operation including an inner portion extending from a first radius to a larger second radius in which thermal mass increases with increasing radius, an inward-facing, upstanding surface at the second radius for retaining the substrate, and an outer portion contiguous with the inner portion, the outer portion extending outward from the second radius;
- and
- a heat source positioned directly opposite the open central region of the edge ring support so as to radiate heat energy directly onto a surface of the substrate during operation.
A method for thermal processing a substrate in a thermal process chamber, comprising the steps of:
- supporting the substrate on an inner portion of an edge ring within the chamber, the inner portion having a graded thermal mass that increases with an outward radial distance from an inner edge;
- positioning a heat source directly opposite the edge ring;
- and
- radiating energy from a heat source onto a surface of the substrate to heat the substrate.
1 more element
Dependencies are inferred from the claim text.