Tray with flippable cover
AssigneeAdvanced Micro Devices, Inc.
InventorSaragarvani Pakeriasamy
Life of this patent
Estimating the term…
Abstract
A .mu.BGA carrier for packing and shipping of a plurality of .mu.BGA packages is specially adapted for facilitating the inspection of the solder balls on the bottom surfaces of the .mu.BGA packages. The carrier consists of a tray member having a plurality of first pockets disposed therein for packing and storing the plurality of .mu.BGA packages, and a lid member having a plurality of second pockets formed therein. The second pockets are vertically aligned with corresponding ones of the plurality of first pockets in the tray member when the lid member is placed on top of the tray member. The carrier can be flipped upside-down so that when the tray member is removed the solder balls are facing upwardly to allow inspection of the same.
Claims4
A .mu.BGA carrier for packing and shipping a plurality of .mu.BGA packages, said .mu.BGA carrier comprising in combination:
- a substantially square-shaped tray member being formed of a ledge portion and a centrally raised platform surrounded on each side by said ledge portion;
- a plurality .mu.BGA packages, each of said plurality of .mu.BGA packages including opposed side edges, opposed end edges, a ton surface, and a bottom surface, said bottom surface having a plurality of solder balls formed thereon;
- said centrally raised platform having a plurality of first pockets disposed therein for packing and storing the plurality of .mu.BGA packages;
- each of said plurality of first pockets being dimensioned so as to conform to the contour of said .mu.BGA packages;
- each of said first Dockets including opposed raised end support members and a slightly stepped center portion sandwiched between said end support members;
- said stepped center portion having a central aperture so as to provide ventilation to said .mu.BGA packages;
- said opposed end support members supporting only said bottom surface adjacent said opposed end edges of said .mu.BGA package so that said solder balls are suspended freely above said stepped center portion;
- said solder balls being substantially aligned over the central aperture in said stepped center portion;
- a substantially square-shaped lid member being formed of a raised lip portion and a central cavity portion surrounded on each side by said lip portion;
- said central cavity portion having a plurality of second pockets formed therein which are vertically aligned with corresponding ones of said plurality of first pockets in said tray member when said lid member is placed on top of said tray member and
- each of said plurality of second pockets being dimensioned so as to conform to the contour of said .mu.BGA packages.
Dependencies are inferred from the claim text.