Press-fit shields for electronic assemblies, and methods for assembling the same

A shield for an electrical component for use in an electronic device comprising:

• an electronic substrate
• a conductive cover including,
• a roof, and
• a wall integrally formed with said roof, said wall defining a peripheral end portion of said cover, said cover defining an inner cavity configured to receive at least one electrical component therein;
• a plurality of conductive mounting pins integral with and extending from said wall peripheral end portion, said pins configured to form a solder-free connection with a surface of an electronic substrate and to releasably, electrically contact a ground plane of the electronic substrate said pins having a cross-shaped section between said wall peripheral end portion and a proximal end adjacent said cover;
• a conductive gasket connected with said peripheral end portion of said cover, said gasket configured to electrically couple the surface of the electronic substrate to the covert
• wherein each of said pins has a greater cross-sectional area in said proximal end adjacent said wall than a cross-sectional area in said opposite distal end, said cross-sectional areas of each of said distal end portions being smaller than cross-sectional areas of respective prearranged holes in said electronic substrate such that said pins are configured to self-locatingly press-fittingly insert in said prearranged holes in said electronic substrate;
• and
• wherein the cross-shaped section of each sin has an undeformed configuration when not inserted in a respective one of said prearranged holes and a deformed configuration when inserted in a respective one of said prearranged holes.

An electronic package comprising:

• an electronic substrate including,
• a first surface,
• a plurality of electronic components on said first surface,
• a second surface opposite the first surface, and
• a ground plane;
• a shield releasably press-fit inserted into said first surface of said electronic substrate, said shield including:
• a conductive cover having a roof and a bottom peripheral edge which defines a cavity having at least one of said plurality of said electronic components positioned in said cavity;
• a conductive gasket connected between said bottom peripheral edge and said electronic substrate;
• and
• a plurality of conductive mounting pins integral with and extending from the bottom peripheral edge of said cover, said pins having a cross-shaped section between said bottom peripheral edge and a proximal end adjacent said cover, said pins inserted into said first surface of said electronic substrate in a solder-free connection and electrically contacting said ground plane of said electronic substrate, and wherein the cross-shaped section of each Pin has an undeformed configuration when not inserted in said first surface of said electronic substrate and a deformed configuration when inserted in said first surface of said electronic substrate.