Method for in-situ incorporation of desirable impurities into high pressure oxides
AssigneeMicron Technology, Inc.
InventorsDavid L. Chapek, Randhir P. S. Thakur
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AssigneeMicron Technology, Inc.
InventorsDavid L. Chapek, Randhir P. S. Thakur
Estimating the term…
A desirable impurity, such as reactive gases and inert gases, is safely introduced into a substrate/oxide interface during high pressure thermal oxidation. Desirable impurities include chlorine, fluorine, bromine, iodine, astatine, nitrogen, nitrogen trifluoride, and ammonia. In one embodiment, the desirable impurity is introduced into a processing chamber prior to the high pressure oxidation step. Then, the temperature is brought to or maintained at an oxidation temperature. In another embodiment, the desirable impurity is introduced into the processing chamber after the high pressure oxidation step, while the temperature is still sufficiently high for oxidation. In yet another embodiment, the desirable impurity is introduced into the processing chamber both before and after the high pressure oxidation step.
A method for introducing an impurity into an oxide supported by a substrate, comprising the steps of:
A method for introducing an impurity into an oxide supported by a substrate, comprising the steps of:
A method for introducing an impurity into an oxide supported by a substrate, comprising the steps of:
A method for introducing an impurity into an oxide, comprising the steps of:
A method for introducing an impurity into an oxide, comprising the steps of:
A method for forming an oxide layer supported by a substrate, comprising the steps of:
A method for introducing an impurity into an oxide supported by a substrate, comprising the steps of:
A method for introducing an impurity into an oxide supported by a substrate, comprising the steps of:
A method for introducing an impurity into an oxide supported by a substrate, comprising the steps of:
Dependencies are inferred from the claim text.