Method and apparatus for preventing cracks in semiconductor die
AssigneeCypress Semiconductor Corporation
InventorsMarc Hartranft, Pat Zicolello
Life of this patent
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Abstract
An anchor structure placed in an open field in corner areas of the semiconductor die and along die edges for preventing cracks in the die. In the corner areas, the anchor structure is placed perpendicular to a resultant vector force, which is approximately at a 45.degree. angle to an imaginary horizontal line passing through the die. This perpendicular placement of the anchor structure more uniformly distributes the stresses along the anchor preventing corner cracks in the die. Along the die edges, the anchor structures are placed approximately perpendicular to the resultant vector forces that impinge the die edges.
Claims12
A method for preventing shear stress damage to a semiconductor die, said semiconductor die having corner areas and edges, comprising the steps of:
- a) reserving a portion of the corner area of the die as an open field;
- and
- b) placing an anchor structure comprising metal, oxide and polysilicon in the open field, wherein the anchor structure is perpendicular to a resultant force vector of the shear stress, said vector being at approximately a 45.degree. angle with an imaginary horizontal line passing through the die.
A method for preventing shear stress damage to a semiconductor die, said semiconductor die having corner areas and edges, comprising the steps of:
- a) reserving a portion along the die edges as open edge fields;
- and
- b) placing anchor structures comprising metal, oxide and polysilicon in these open edge fields, wherein the anchor structure is perpendicular to a resultant force vector of the shear stress, impinging the die edges.
Dependencies are inferred from the claim text.