System and apparatus for reducing arcing and localized heating during microwave processing

A holder for selectively protecting portions of a microelectronic substrate from damage in a microwave processing environment said holder comprising:

• a substantially microwave-transparent base, said base including at least one internal bore sized and configured to receive an electrical conductor, said bore having a substrate end located to provide the electrical conductor to the microelectronic substrate, and a ground end opposite the substrate end for providing the electrical conductor to ground;
• an electrical conductor extending through said at least one internal bore, said electrical conductor having a substrate end with a connector configured to electrically interconnect with the microelectronic substrate and a ground end configured to electrically interconnect with a ground;
• a microwave-absorbent mass positioned on said base so that a predetermined portion of the microelectronic substrate overlies said mass when the microelectronic substrate is secured to said base;
• means for removably securing the microelectronic substrate to said base;
• and
• at least one heat sink for overlying selective portions of at least one microelectronic substrate secured to said base.

A holder for selectively protecting portions of a microelectronic substrate from damage in a microwave processing environment said holder comprising:

• a substantially microwave-transparent base, said base including at least one internal bore sized and configured to receive an electrical conductor, said bore having a substrate end located to provide the electrical conductor to the microelectronic substrate, and a ground end opposite the substrate end for providing the electrical conductor to ground;
• an electrical conductor extending through said at least one internal bore, said electrical conductor having a substrate end with a connector configured to electrically interconnect with the microelectronic substrate and a ground end configured to electrically interconnect with a ground;
• a pin having a tip and extending from said base so that said tip is in adjacent relationship to a predetermined portion of the microelectronic substrate when the microelectronic substrate is secured to said base, and a ground end opposite from said tip, electrically interconnected with the electrical conductor;
• means for removably securing the microelectronic substrate to said base;
• and
• at least one heat sink overlying selective portions of at least one microelectronic substrate secured to said base.