Method for producing semiconductor device
AssigneeSemiconductor Energy Laboratroy Co., Ltd.
InventorsHisashi Ohtani, Takeshi Fukunaga, Akiharu Miyanaga
Life of this patent
Estimating the term…
Loading patent…
AssigneeSemiconductor Energy Laboratroy Co., Ltd.
InventorsHisashi Ohtani, Takeshi Fukunaga, Akiharu Miyanaga
Estimating the term…
A metal element density is lowered in a crystalline silicon film obtained by four hour treatment at about 550.degree. C. by using a catalyst metal which accelerates crystallization. At the same time, a crystalline silicon film can be obtained which has a high crystallinity. For this purpose, extremely oxide film 13 is formed on an amorphous silicon film formed on this glass substrate in the beginning. An aqueous solution of acetate added with 10 to 200 ppm (need adjustment) of catalyst element like nickel or the like is dripped. This state is held for a predetermined time. Then the spin drying is performed by using a spinner. The film is crystallized by four hour treatment at 550.degree. C. Then a localized nickel component is removed by the fluoric acid treatment. Further, the crystalline silicon film is obtained by laser light irradiation. Then a crystalline silicon film is obtained having a low density of metal element and a small defect density by four hour heat treatment at 550.degree. C.
A method for producing a semiconductor device comprising the steps of:
A method for producing a semiconductor device comprising the steps of:
A method for producing a semiconductor device comprising the steps of:
A method for producing a semiconductor device comprising the steps of:
A method for producing a semiconductor device comprising the steps of:
A method for producing a semiconductor device comprising the steps of:
Dependencies are inferred from the claim text.