Semiconductor wafer anchoring device
AssigneeSamsung Electronics Co., Ltd.
InventorsChe-young Lee, Young-kyou Park, Seok-jun Lee
Life of this patent
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Abstract
A semiconductor wafer anchoring device, which includes a platen having a flat upper surface adapted for mounting a semiconductor wafer thereon, an elastic O-ring located between the platen and the semiconductor wafer, and a clamp disposed to face with the O-ring, which is adapted for pressing upon the upper surface of the semiconductor wafer and for anchoring same. The clamp is a ring-type plate having an inner diameter larger than the diameter of the semiconductor wafer, and having a plurality of protrusions projecting from each quadrant of an inner circumferential surface of the ring-type plate toward the center thereof, an end of each protrusion being adapted to be positioned between a chip pattern and the edge of the semiconductor wafer.
Claims3
A semiconductor wafer anchoring device comprising:
- a platen having a flat upper surface, which is adapted for mounting a semiconductor wafer thereon;
- an elastic O-ring located between said platen and said semiconductor wafer;
- and
- a clamp opposing said O-ring, which is adapted for pressing upon an upper surface of said semiconductor wafer and thus anchoring said wafer,
- said clamp having an annular plate with an inner diameter larger than the diameter of said semiconductor wafer, and having a plurality of protrusions projecting from each quadrant of an inner circumferential surface of the annular plate toward the center of each wafer, said each quadrant corresponding to locations of outermost chip patterns on said semiconductor wafer, each of said plurality of protrusions having a distal end completely positioned between said outermost chip patterns and a peripheral edge of said semiconductor wafer, wherein adjacent ones of said plurality of protrusions in each quadrant are spaced apart with a gap therebetween along said inner circumferential surface.
Dependencies are inferred from the claim text.