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US 5,839,456 AGranted
Wafer wet treating apparatus
AssigneeLG Semicon Co., Ltd.
InventorSuk Bin Han
Life of this patent
Estimating the term…
Abstract
A wafer wet treatment apparatus includes a first supply/discharge line, an outer bath connected to the first supply/discharge line, an inner bath within the outer bath, a second supply/discharge line connected to the inner bath, and at least one partition located on a portion of the inner bath.
Claims13
A wafer wet treatment apparatus comprising:
- a first supply/discharge line;
- an outer bath connected to the first supply/discharge line;
- an inner bath within the outer bath;
- a second supply/discharge line connected to the inner bath;
- at least one removable partition located within the inner bath and dividing the inner bath into isolated portions;
- and
- at least one partition receiving member for holding the at least one removable partition.
4 more elements
Dependencies are inferred from the claim text.