Polishing apparatus including thickness or flatness detector
AssigneeEbara Corporation
InventorsHirokuni Hiyama, Yutaka Wada
Life of this patent
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AssigneeEbara Corporation
InventorsHirokuni Hiyama, Yutaka Wada
Estimating the term…
A polishing apparatus polishes a workpiece such as a semiconductor wafer while detecting a thickness or a flatness of a surface layer of the workpiece on a real-time basis. The polishing apparatus includes a turntable with a polishing cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and such workpiece against the polishing cloth. The polishing apparatus also has a thickness detector for detecting the thickness of a surface layer of the workpiece supported by the top ring while the workpiece is being polished without exposing the workpiece. The thickness detector includes a sensor mounted in the turntable and including at least one light-emitting element for emitting light toward the surface layer of the workpiece and at least one light-detecting element for detecting light reflected from the surface layer of the workpiece.
A polishing apparatus comprising:
A polishing apparatus comprising:
A polishing apparatus comprising:
Dependencies are inferred from the claim text.