Method for assembling a detection unit for electromagnetic and in particular infrared waves with a thermally conducting substrate and an electromagnetic and in particular an infrared detector with which to implement this method

A detector of infrared radiation, comprising:

• a detection unit incorporated inside a cryostatic enclosure;
• said detection unit comprising:
• a detection circuit for said infrared radiation;
• a readout circuit, electrically and mechanically connected by indium microspheres to said detection circuit;
• a cold plane affixed to a cold conduit of a cryogenic system;
• an intermediary component adhesively bonded to the readout circuit and to the cold plane wherein the intermediary component is formed from a single element having dimensions that are dependent upon that of the readout circuit to which said intermediary component is joined, such that the intrinsic differential expansion effects of each of the readout circuit, intermediary component and cold plane are compensated, said intermediary component being affixed by an epoxy glue joint to the readout circuit and by a silicone glue joint to the cold plane.

A detector of infrared radiation, comprising:

• a detection unit incorporated inside a cryostatic enclosure;
• said detection unit comprising:
• a detection circuit for said infrared radiation;
• a readout circuit, electrically and mechanically connected through indium microspheres to said detection circuit;
• a cold plane affixed to a cold conduit of a cryogenic system;
• an intermediary component adhesively bonded to the readout circuit and to the cold plane wherein the intermediary component comprises two mutually parallel plates, an upper plate joined mechanically and electrically by a conducting epoxy-glue to the readout circuit, and a lower plate affixed by a silicone-glue joint to said upper plate, said lower plate adhesively joined to the cold plane, the materials and the thicknesses of said two mutually parallel plates depending on that of the readout circuit, such that the intrinsic effects of differential expansion of each of the readout circuit, intermediary component and cold plane are compensated.