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US 5,739,463 AGranted
Sealed electronic packaging for environmental protection of active electronics
AssigneeRaychem Corporation
InventorsSteve Diaz, Dave Horsma, Narendra Kulkarni, Peter Lundquist, Akira Nakazato, Nelson Shen, Paul von der Lippe
Life of this patent
Estimating the term…
Abstract
An environmentally sealed electronics assembly. The assembly includes a flexible envelope surrounding the active electronics board. The electronics board is insertable into the envelope and with subsequent sealing provides a reenterable but environmentally sealed active electronics package. Methods of manufacturing the assembly are also described.
Claims12
A protection apparatus for an active electronics circuit board comprising:
- a flexible environmental gas and liquid barrier envelope capable of accepting the active electronics circuit board, said envelope completely sealed around the entire said active electronics circuit board;
- and an interconnection device sealed to said envelope which contains the active electronics circuit board and also permitting the connection of the active electronics circuit board into an electronics system outside said sealed envelope;
- and
- wherein the interior of the envelope contains an infra red radiation absorbing black coating.
1 more element
A protection apparatus for an electronic circuit board comprising:
- a flexible environmental gas and liquid barrier envelope capable of accepting the active electronics circuit board, said envelope completely sealed around said active electronics circuit board;
- and an interconnection device sealed to said envelope which contains the active electronic printed circuit board and also permitting the connection of the active electronics circuit board into an electronics system;
- and
- wherein the flexible envelope comprises at least two plastic layers and a central metal layer wherein the outermost plastic layers are about between 75 to about 200 microns, the interior plastic layers are from about 20 to 200 microns and the central metallic layer is from about 5 to 75 microns.
1 more element
Dependencies are inferred from the claim text.