Leadframe ball grid array package

Abstract

A leadframe ball grid array package for packaging an integrated-circuit die includes a metallic substrate having a central portion and a leadflame having a plurality of inwardly-extending bonding fingers and a centrally-located open portion. The leadframe is directly attached to the metallic substrate by a non-conductive adhesive so that the open portion thereof overlies the central recessed portion of the metallic substrate. An integrated-circuit die is mounted in the central portion of the metallic substrate. The bonding fingers are disposed peripherally surrounding the integrated-circuit die. Bonding wires are interconnected between bonding pads formed on the integrated-circuit die and the plurality of bonding fingers. A solder mask is disposed over the top surface of the leadframe so as to form selective solderable areas. Solder balls are attached to the selective solderable areas. A plastic material or a lid is applied over the top surface of the die, bonding fingers and bonding wires.

Dependencies are inferred from the claim text.