Back to results
US 5,710,457 AGranted
Semiconductor integrated circuit
AssigneeNEC Corporation
InventorTakayuki Uno
Life of this patent
Estimating the term…
Abstract
A semiconductor integrated circuit is characterized in that a semiconductor chip and the distal end portions of inner leads are adhered and fixed using a coupling support member consisting of an insulating film with an insulating adhesive layer so as to expose the bonding pads of the chip and the bonding pads of the inner leads. In this structure, a conventional wire bonding technique can be applied, and contact between bonding wires and the chip can be prevented.
Claims6
An integrated circuit (IC) package, for packaging an IC chip with a plurality of bonding pads on one major surface, said IC package comprising:
- a plurality of leads each said lead having an outer portion and an inner portion;
- a plurality of bonding wires, each of said bonding wires electrically connecting a contacting area of one of said leads to a corresponding said bonding pad on said IC chip packaged in said IC package;
- a sheet-like coupling support member having an insulated side and an insulating adhesive side, said sheet-like coupling support member further comprising:
- a chip fixing portion on said insulating adhesive side, said IC chip being fixedly adhered to chip faring portion on said major surface, and
- a lead fixing portion for fixedly adhering a distal end of each of said plurality of leads, each said lead contact area being separated from said chip fixing portion by said lead fixing portion,
- each said bonding wire extending from said corresponding bonding pad, across the insulated side of said lead fixing portion to said lead contacting area on one of said plurality of leads;
- and
- a sealing resin covering and sealing said packaged IC chip, said bonding wires, said sheet-like coupling support member and said lead contact area on each of said leads.
5 more elements
Dependencies are inferred from the claim text.